Products
XBW262-Fully Automatic Wafer Temporary Bonder
| 4”-8”wafer bonding application Thinner wafer capability Vacuum thermal press tape Wafer cassette loading & unloading Automatic device wafer & support wafer aligning Automatic bonding tape laminating Wafer intelligent mapping in cassette Bonder wafer measuring post bonding (Optional) PC based control with Windows OS SECS/GEM or simple communication |
